Proteus 8.3 SP2 with Advanced Simulation
Proteus 8.3 was largely based around re-working the way in which we transition from PCB Layout (ECAD) through to mechanical layout (MCAD). Over the last few years the STEP file format has become the de-facto standard for data exchange and we have therefore implemented full support in the Version 8.3 release.
We have also taken a close look at our customer feedback logs and implemented several of the most requested features. Main highlights of this release include:
Support for MCAD data exchange via STEP and IGES file formats. Both import of component STEP/IGES files and export of the resulting STEP Assembly is supported (requires L2 or higher
Extensive modifications to existing libraries to include pre-supplied STEP files for radial electrolytics, connectors and some other common parts
Support for multiple track editing operations and enhancements to track necking
Enhanced support for design re-use via sub-circuit binding on the Replicate command
Enhancement of print sets in ARES to allow paste and soldermask prints alongside copper layers
Addition of single layer options for keepout objects (ctx menu command on the keepout object
Significant rework of the PDF output to address various issues with the existing implementation. Also added SVG output
Addition of MSP430G2x variant set
Addition of PIC18F45K50 variant set
Addition of ILI9341 TFT LCD (SPI Mode Only) and associated Arduino Shield
[/center]Proteus 8.3 was largely based around re-working the way in which we transition from PCB Layout (ECAD) through to mechanical layout (MCAD). Over the last few years the STEP file format has become the de-facto standard for data exchange and we have therefore implemented full support in the Version 8.3 release.
We have also taken a close look at our customer feedback logs and implemented several of the most requested features. Main highlights of this release include:
Support for MCAD data exchange via STEP and IGES file formats. Both import of component STEP/IGES files and export of the resulting STEP Assembly is supported (requires L2 or higher
Extensive modifications to existing libraries to include pre-supplied STEP files for radial electrolytics, connectors and some other common parts
Support for multiple track editing operations and enhancements to track necking
Enhanced support for design re-use via sub-circuit binding on the Replicate command
Enhancement of print sets in ARES to allow paste and soldermask prints alongside copper layers
Addition of single layer options for keepout objects (ctx menu command on the keepout object
Significant rework of the PDF output to address various issues with the existing implementation. Also added SVG output
Addition of MSP430G2x variant set
Addition of PIC18F45K50 variant set
Addition of ILI9341 TFT LCD (SPI Mode Only) and associated Arduino Shield
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